Printed Circuit Board Carriers
PCB Carrier Boards are used throughout the printed circuit board manufacturing process. Process carrier pallets are typically manufactured from a high strength, chemical resistant, thermoset composite material. These composite materials are available in a variety of grades to meet the demands of a wide range of applications.
The Gund Company manufactures custom carrier pallets to meet the particular needs of specific printed circuit board production lines. In the following pages, we detail several common types of carrier pallets. Each of these types of pallets has its own unique characteristics in terms of design. TGC works closely with each customer to determine the optimal design.
In addition to offering an infinite number of potential designs, The Gund Company also offers a complete line of pallet materials to meet the needs of our customer’s unique processes. Though each type of pallet may typically use the same types of materials, each unique application deserves its own engineering review to determine the best design and material for the process.
- Pick & Place / Placement Pallets
- IR Reflow Pallets
- Wave Solder Pallets
- Screen Printing Pallets
Other types of pallets include:
- Standard Carrier Pallets
- Polycarbonate Covered Pallets
- Adjustable Pallets
- Component Hold Down Pallets
- Rotary Fixture Pallets
Of course, the design parameters for a particular pallet will depend on the particular process steps for that pallet. Some pallets are used for specific process such a Pick N Place. The specific function of each pallet can be designed with that process’s parameters in mind. Other pallets that follow the PCB through multiple process steps have to be designed to withstand the most demanding parameters typically found in wave solder equipment.
There are a wide variety of materials used for process carrier boards. In addition to composite materials, aluminum and titanium pallets are quite common. However, the durability, electro static dissipative, and thermal resistance properties of composite boards offer an attractive alternative to traditional pallet materials. Common PCB process carrier board materials available from The Gund Company include the following:
- Glass Epoxy Laminate, NEMA Grade G-10/FR-4
- Glass Epoxy Laminate, NEMA Grade G-11
- Glass Epoxy Laminate – Semiconductive – NEMA Grade G-11
- Glass Epoxy Laminate, Grade G-11EM
- Glass Epoxy Laminate, Grade G-11ES
- Paper / Glass Epoxy Laminate, NEMA CEM-1
- Glass Polyester Laminate, Grade SPM-11
- Glass Polyester Laminate, Grade CBC
- Glass Polyester Laminate, Grade CBC-C & CBC-NBC
- Glass Polyester Laminate, Grade Durostone CAS760
- Glass Polyester Laminate, Grade Durostone CAS761
- Glass Polyester Laminate, Grade Durostone CAS762
- Glass Epoxy Laminate, Grade CDM 68.650
- Glass Epoxy Laminate, Grade CDM-ESD 68.610
Whatever your pallet requirement, please contact TGC with your specific parameters for a custom solution.
